Masters and Ph.D Students graduated:

  1. H.Lai, Masters, Winter 1991.
  2. T.Dichiaro, Masters, Fall 1992.
  3. C.Engle, Masters, Spring 1994.
  4. T.Singh, Ph.D, March 1994.
  5. S.Jayaraman, Masters, November 1994.
  6. G.Qian, Ph.D, September 1995.
  7. T.Kumar, Ph.D, March 1997 (ECECS Best Ph.D Thesis Award).
  8. G.Srinivasan, Masters, May 1997.
  9. P.Mumford, Ph.D, August 1997.
  10. A. Malhotra, Masters, June 1999.
  11. S.Ekbote, Ph.D, December 1999 (ECECS Best Ph.D Thesis Award).
  12. B.Garber, Masters, December 1999.
  13. J.Thachery, Masters, January, 2002.
  14. V.M.Krishna Prasad, Masters, Spring 2003.
  15. V.Muthiah-Nakarajan, Masters, Spring 2003.
  16. R.Krishnan, Masters, Spring 2003.
  17. Y.Modukuru, Ph.D, Summer 2003.
  18. K. Garre, Masters, Summer 2004.
  19. S. Uppaluri, Masters, Winter 2005.
  20. L. Venkatraman, Masters, Spring 2005.
  21. P. Draviam, Masters, Spring 2005.
  22. K. Rangaswamy, Masters, Spring 2005.
  23. K. Garre, Ph.D, Fall 2008.
  24. S.H. Mohan, Masters, Fall 2008.
  25. N.K. Bhandari, Masters, Spring 2009.
  26. C. Huo, Masters, Summer 2009.
  27. A. Rakurthi, Masters, May 2010 (Best Masters Thesis Award).
  28. V.S. Govindarajan, Masters, June 2010.
  29. W. Liu, Masters, October 2010.
  30. S. Shary, Masters, November 2010.
  31. J. Wan, Ph.D, December 2010.
  32. P.P. Das, Ph.D, June 2012.

Positions Held by Graduating Students:

  1. H.Lai, Device Engineer, Intel, CA.
  2. T.Dichiaro, Ph.D student CSD group, UC.
  3. C.Engle, Test Engineer, TI, Houston, TX.
  4. T.Singh, Postdoc, University of Illinois, Urbana-Champaign, IL.
  5. S.Jayaraman, Test Engineer, TI, Houston, TX.
  6. G.Qian, Device Engineer, Maxim Integrated Products (formerly Dallas Semiconductors), Dallas, TX.
  7. T.Kumar, Test Engineer, Maxim Integrated Products (formerly Dallas Semiconductors), Dallas, TX.
  8. G.Srinivasan, Device Engineer with VLSI, Santa Clara, CA.
  9. P.Mumford, Device Engineer, WPAFB, Dayton, Ohio.
  10. A. Malhotra, ASIC Customer Engineer, LSI logics, CA.
  11. S.Ekbote, Integration Engineer (TI), Dallas, TX.
  12. B.Garber, Design Engineer, Honeywell, Urbana, Ohio.
  13. Y.Modukuru, Design Engineer, Qualcomm, Silicon valley, CA.
  14. V.Muthiah-Nakarajan, Program Director-ECE, Research & Virtual Education, SRM IST, India.